Standard

DS/EN 60068-2-54:2006 - Tilbagetrukket

Miljøprøvninger – Del 2-54: Prøvninger – Prøvning Ta: Prøvning af elektroniske komponenters loddeevne ved fugtbalancemetoden

Status
TilbagetrukketTilbagetrukket
Type
Standard
Varenummer
54916
Udgivelsesdato
2006-12-21
Komite

CLC/SR 91

IEC/TC 91

Internationale relationer
Tooltip
IEC 60068-2-54:2006 ED2 IDT, EN 60068-2-54:2006 IDT
Dansk udvalg
Antal sider
28
Under revision

Scope

This part of 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.